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preliminary datasheet primary side power switcher for off-lin e smps AP3967 sep. 2012 rev. 1. 0 bcd semiconductor manufacturing limited 1 general description the AP3967 consists of a primary side regulation controller and a high voltage transistor, and is specially designed for off-line power supplies within 3.5w output power. typical applications include adapter for adsl and auxiliary supplies. the AP3967 operates at pulse frequency modulation (pfm), and provides accurate constant voltage, constant current (cv/cc) regulation without requiring an opto-coupler and secondary control circuitry. it has internal cable compensation function for tight constant voltage regulation. the AP3967 solution has fewer component numbers, smaller size, and lower total cost. the AP3967 is packaged in soic-7. features ? primary side control for eliminating opto-coupler and secondary cv/cc control circuitry ? built-in npn transistor with 700v cbo ? low start-up current: 0.2 a (typ.) ? internal output cable voltage drop compensation ? random frequency modulation for low emi ? short circuit protection ? low total cost solution ? output power range: for 3.5w adapter applications ? chargers ? adapters ? set top boxes ? auxiliary supplies ? dvd ? led driver soic-7 figure 1. package type of AP3967
preliminary datasheet primary side power switcher for off-lin e smps AP3967 sep. 2012 rev. 1. 0 bcd semiconductor manufacturing limited 2 cpc fb vcc cs c c gnd 1 2 3 4 7 6 5 pin configuration m package (soic-7) figure 2. pin configurat ion of AP3967 (top view) pin description pin number pin name function 1 cpc this pin connects a capacitor to gnd for output cable compensation 2 fb the voltage feedback from auxiliary winding 3 vcc this pin receives rectified volta ge from the auxiliary winding of the transformer 4 cs current sense for primary side of transformer 5, 6 c this pin is connected with an internal power bjt?s collector 7 gnd this pin is the signal reference ground
preliminary datasheet primary side power switcher for off-lin e smps AP3967 sep. 2012 rev. 1. 0 bcd semiconductor manufacturing limited 3 functional block diagram figure 3. functional block diagram of AP3967
preliminary datasheet primary side power switcher for off-lin e smps AP3967 sep. 2012 rev. 1. 0 bcd semiconductor manufacturing limited 4 ordering information AP3967 - package temperature range part number marking id packing type soic-7 -40 to 85 c AP3967m-g1 3967m-g1 tube AP3967mtr-g1 3967m-g1 tape & reel bcd semiconductor's pb-free products, as designated with "g1" suffix in the part number, are rohs compliant and green. g1: green tr: tape & reel blank: tube package m: soic-7 circuit type
preliminary datasheet primary side power switcher for off-lin e smps AP3967 sep. 2012 rev. 1. 0 bcd semiconductor manufacturing limited 5 absolute maximum ratings (note 1) parameter symbol value unit supply voltage v cc -0.3 to 22 v fb input voltage v fb -1 to 10 v collector-emitter voltage v cbo 700 v collector dc current 0.8 a operating junction temperature t j 150 oc storage temperature t stg -65 to 150 oc lead temperature (soldering, 10 sec) t lead 300 oc esd (machine model) 200 v esd (human body model) 2000 v note 1: stresses greater than those listed under ?absolute maximum ratings? may cause permanent damage to the device. these are stress ratings only, and functional op eration of the device at these or any other conditions beyond those indicated under ?recommended operating co nditions? is not implied. exposure to ?absolute maximum ratings? for extended periods may affect device reliability. recommended operating conditions parameter symbol min max unit supply voltage v cc 22 v operating temperature range t op -40 85 c maximum operating frequency f max 60 khz
preliminary datasheet primary side power switcher for off-lin e smps AP3967 sep. 2012 rev. 1. 0 bcd semiconductor manufacturing limited 6 electrical characteristics v cc =15v, t j =25c, unless otherwise specified. parameter symbol conditions min typ max unit uvlo section turn-on voltage v on 13 15 17 v turn-off voltage v off no drive current 4.5 5.3 6.3 v standby current section start-up current i st v cc =v on -0.5v 0.2 0.6 a operating current i cc 320 435 550 feedback input section fb input current i fb v fb =4v 1.5 3.5 5.5 a fb threshold voltage v fb 4.214 4.278 4.342 v power transistor section collector-emitter saturation voltage v ce(sat) i c =200ma 0.3 v dc current gain h fe 15 23 leakage current i ceo 60 na over temperature protection shutdown temperature t shdn surface temperature 125 160 oc temperature hysteresis 40 oc thermal impedance parameter symbol value unit junction to ambient ja 80 oc/w junction to case jc 40
preliminary datasheet primary side power switcher for off-lin e smps AP3967 sep. 2012 rev. 1. 0 bcd semiconductor manufacturing limited 7 -40-20 0 20406080100120 13.0 13.5 14.0 14.5 15.0 15.5 16.0 16.5 17.0 turn-on voltage (v) ambient temperature ( o c) 125 -40 -20 0 20 40 60 80 100 120 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 turn-off voltage (v) ambient temperature ( o c) 125 -40 -20 0 20 40 60 80 100 120 300 350 400 450 500 550 600 operating current ( a) ambient temperature ( o c) 125 typical performance characteristics figure 4. turn-on voltage vs. ambient temperature figure 5. turn-off voltage vs. ambient temperature figure 6. operating current vs. ambient temperature
preliminary datasheet primary side power switcher for off-lin e smps AP3967 sep. 2012 rev. 1. 0 bcd semiconductor manufacturing limited 8 operation description + c1 + c o v o d1 r fb1 r fb2 r cs c fb cs gnd AP3967 ns n aux np iout vs v aux v in l m cpc c cpc q1 figure 7. simplified flyback converter controlled by AP3967 figure 7 illustrates a simplified flyback converter controlled by AP3967. constant primary peak current the primary current ip(t) is sensed by a current sense resistor r cs as shown in figure 7. the current rises up linearly at a rate of: m l ) t ( vg dt ) t ( dip = ??? ?(1) figure 8. primary current waveform as illustrated in figure 8, when the current ip(t) rises up to ipk, the switch q1 turns off. the constant peak current is given by: rcs vcs ipk = ???? (2) the energy stored in the magnetizing inductance l m each cycle is therefore: 2 m ipk l 2 1 eg ? ? = ?? ??(3) so the power transferring from input to output is given by: sw 2 m f ipk l 2 1 p ? ? ? = ??? ?(4) where f sw is the switching frequency. when the peak current ipk is constant, the output power depends on the switching frequency f sw . constant voltage operation the AP3967 captures the auxiliary winding feedback voltage at fb pin and operates in constant-voltage (cv) mode to regulate the output voltage. assuming
preliminary datasheet primary side power switcher for off-lin e smps AP3967 sep. 2012 rev. 1. 0 bcd semiconductor manufacturing limited 9 the secondary winding is master, the auxiliary winding is slave during the d1 on-time. the auxiliary voltage is given by: () d s aux aux v vo n n v + ? = ????(5) where v d is the diode forward drop voltage, n aux is the turns of auxiliary winding, and n s is the turns of secondary winding. figure 9. auxiliary voltage waveform the output voltage is different from the secondary voltage in a diode forward drop voltage v d which depends on the current. if the secondary voltage is always detected at a consta nt secondary current, the difference between the output voltage and the secondary voltage will be a fixed v d . the voltage detection point is portion of tons after d1 is turned on. the cv loop control function of AP3967 then generates a d1 off-time to regulate the output voltage. constant current operation the AP3967 is designed to work in constant current (cc) mode. figure 10 shows the secondary current waveforms. figure 10. secondary current waveform in cc operation, the cc loop control function of AP3967 will keep a fixed proportion between d1 on-time tons and d1 off-time toffs by discharging or charging the built-in capacitance connected. this fixed proportion is: 3 4 toffs tons = ???? (6) the relation between the output constant-current and secondary peak current ipks is given by: toffs tons tons ipks 2 1 iout + ? ? = ????(7) at the instant of d1 turn -on, the primary current transfers to the secondar y at an amplitude of: ipk n n ipks s p ? = ????(8) thus the output constant current is given by: ipk n n 7 2 iout s p ? ? = ????(9) leading edge blanking (leb) when the power switch is turned on, a turn-on spike on the output pulse rising edge will occur on the sense-resistor. to avoid false termination of the switching pulse, a typical 500ns leading edge blanking is built in. during this blanking period, the current sense comparator is disabled and the gate driver can not be switched off. the built-in leb in AP3967 has shorter delay time from current sense terminal to output pulse than those ic solutions adopting external rc filter as leb. built-in cable compensation the AP3967 has built-in fixed voltage of 0.35v typical to compensate the dr op of output cable when the load is changed from zero to full load. a typical 0.01 f external capacitor connected to the cpc pin is used to smooth voltage signal for cable compensation. over temperature protection the AP3967 has internal thermal sensing circuit to shut down the pfm driver output when the die temperature reaches 160oc typical. when the die temperature drops about 40oc, the ic will recover automatically to normal operation.
preliminary datasheet primary side power switcher for off-lin e smps AP3967 sep. 2012 rev. 1. 0 bcd semiconductor manufacturing limited 10 typical application figure 11. typical application of AP3967 (5v/700ma) item description qty item description qty c1 10.0 ? , 2w 1 c2 4.7 ? /0.25w 1 c3 3.3 ? ? ? ? ? ? ? ?
preliminary datasheet primary side power switcher for off-lin e smps AP3967 sep. 2012 rev. 1. 0 bcd semiconductor manufacturing limited 11 mechanical dimensions soic-7 unit: mm(inch) 3.800(0.150) 4.000(0.157) 1.270(0.050) typ 4.700(0.185) 5.100(0.201) 0.330(0.013) 0.510(0.020) 0.190(0.007) 0.250(0.010) 0.100(0.004) 0.250(0.010) 1.350(0.053) 1.750(0.069) 0.450(0.017) 0.800(0.031) 8 0 5.800(0.228) 6.200(0.244) 2.54(0.100) typ 1.250(0.049) 1.500(0.059) note: eject hole, oriented hole and mold mark is optional.
important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing co., ltd. 800 yishan road, shanghai 200233, china tel: +021-6485-1491, fa x: +86-021-5450-0008 main site regional sales office shenzhen office shanghai sim-bcd semiconductor manu facturing co., ltd., shenzhen office unit a room 1203,skyworth bldg., gaoxin ave.1.s., nanshan district shenzhen 518057, china tel: +86-0755-8660-4900, fax: +86-0755-8660-4958 taiwan office (taipei) bcd semiconductor (taiwan) company limited 3f, no.17, lane 171, sec. 2, jiu-zong rd., ne i-hu dist., taipei(114), taiwan, r.o.c tel: +886-2-2656 2808 fax: +886-2-2656-2806/26562950 taiwan office (hsinchu) bcd semiconductor (taiwan) company limited 8f, no.176, sec. 2, gong-dao 5th road, east district hsinchu city 300, taiwan, r.o.c tel: +886-3-5160181, fax: +886-3-5160181 - headquarters bcd (shanghai) micro-electronics limited no. 1600, zi xing road, shanghai zizhu scie nce-based industrial park, 200241, p. r.c. tel: +86-021-2416-2266, fax: +86-021-2416-2277 usa office bcd semiconductor corp. 48460 kato road, fremont, ca 94538, usa tel: +1-510-668-1950 fax: +1-510-668-1990 korea office bcd semiconductor limited korea office. room 101-1112, digital-empire ii, 486 sin-dong, yeongtong-gu, suwon-city, gyeonggi-do, korea tel: +82-31-695-8430 important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing limited 800, yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 bcd semiconductor manufacturing limited main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd. shenzhen office advanced analog circuits (shanghai) corporation shenzhen office room e, 5f, noble center, no.1006, 3rd fuzhong road, futian district, shenzhen 518026, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corporation 30920 huntwood ave. hayward, ca 94544, u.s.a tel : +1-510-324-2988 fax: +1-510-324-2788 - ic design group advanced analog circuits (shanghai) corporation 8f, zone b, 900, yi shan road, shanghai 200233, china tel: +86-21-6495 9539, fax: +86-21-6485 9673 bcd semiconductor manufacturing limited http://www.bcdsemi.com bcd semiconductor manufacturing limited important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing co., ltd. 800 yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd., shenzhen office unit a room 1203, skyworth bldg., gaoxin ave.1.s., nanshan district, shenzhen, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corp. 30920 huntwood ave. hayward, ca 94544, usa tel : +1-510-324-2988 fax: +1-510-324-2788 - headquarters bcd semiconductor manufacturing limited no. 1600, zi xing road, shanghai zizhu sc ience-based industrial park, 200241, china tel: +86-21-24162266, fax: +86-21-24162277 important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing limited 800, yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 bcd semiconductor manufacturing limited main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd. shenzhen office advanced analog circuits (shanghai) corporation shenzhen office room e, 5f, noble center, no.1006, 3rd fuzhong road, futian district, shenzhen 518026, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corporation 30920 huntwood ave. hayward, ca 94544, u.s.a tel : +1-510-324-2988 fax: +1-510-324-2788 - ic design group advanced analog circuits (shanghai) corporation 8f, zone b, 900, yi shan road, shanghai 200233, china tel: +86-21-6495 9539, fax: +86-21-6485 9673 bcd semiconductor manufacturing limited http://www.bcdsemi.com bcd semiconductor manufacturing limited

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